PCB Assembly Capability
Production Capability
- High speed SMT line x 4
- Wave soldering line x 2
- AOI x 1
- X-ray x 1
- ICT with test jet x 2
- Traditional insertion line x 2
- Functional test line x 2
- System assembly and Box Building line x 2
Surface Mount PCB Assembly Capability
- High precision 0402, 0603, 0805, 1210 and 2512
- Fine pitch QFP(0.3mm), BGA(0.5mm), IC(0.3mm)
- Max BGA Tin Ball-544 Balls
- Max QFP pin-208pin
- PCB size-50*30*0.4~410*360*0.4(mm)
- Max speed-0.075 sec/chip
- Double side assembly
Inspection
- Automatic Optical Inspection
- BGA Inspection
- BGAs are inspected both visually using an "Ersa Scope" and using an X-Ray system
Lead-Free PCB Assembly
- Lead Free Rigid or Flexible Circuit
- Lead Free Rework
- Lead Free Printed Circuit Boards
- Lead free Board Assembly (SMT or THT/PHT)
- Lead Free Wave Soldering
- Lead Free Materials Analysis
Quality Control
- Our factory is ISO9001:2000 certified.
- All of our production process is compliant IPC-A-610D standard.
- AOI, X-RAY, programm burning, ICT (in-circuit test) and function test.
- Quality control tools are also used for continuous quality improvement.