Capability ＆Technology in PCB Fabrication
- 1 to 30 layer varies type of boards: Rigid, Flex, Rigid-flex PCBs
- Integrated Monthly Capacity up to 1,500,000 sq.ft
- Heavy Copper up to 210um (6oz)
- Selective gold plating, gold thickness up to 3um (120u")
- Leadfree HAL, OSP/ENTEK, Immersion Gold/Tin/Silver...
- Carbon Ink Printing
- Peelable Mask
- Blind & Buried Via holes
- Laser Drilled Holes(HDI, Microvias)
- Aluminium Substrate
- Back Panel, Chip on Board for Wire Bonding
Units Conversion of U.S.CUSTOMER and METRIC
1inch = 1000mil = 2.54cm = 25.4mm
1mm = 0.03937inch = 39.37mil
1mil = 0.0254mm
0.000 001meter = 1um(micron)
0.000 001inch = 1u"(micro inch)
1um = 39.37u"
1um = 0.03937mil
1oz = 35um = 1.4mil
Remarks:
Quality inspection will subject to quality standard and customer specification, capabilities list are for production capability reference only.