Rigid PCB
View our Rigid PCB capability list in PDF
Rigid Board Production
Materials: FR4 , FR4 Tg150, Tg170 and T80, Halogen free FR4, Rogers, Teflon, Arlon, Metal Based (Aluminum, Copper), Mix material
Layer account: 1-38
PCB final thickness: .005" to .315"
Min. trace: .003" - Min. space .003"
Min. finished hole size: .004"(laser drilling), 0.006"(mechanical drilling)
Start copper weight: 1/3 to 28oz
Surface finish: HASL, HAL Lead Free, OSP, Immersion Gold, Immersion Silver, Gold Flash, Immersion Tin, Selective Gold (Au: 50uinch), Gold Fingers (Au: 3-50uinch)
- Controlled impedance, unbalanced dielectric thickness.
- Plated slots and edges.
- Peelable mask, Carbon ink, Capton tape.
- Conductive silver/carbon filled via.
- Counter sink, Tapped hole.
- Blind via, buried via, via in pad, HDI (1+N+1, 2+N+2, 3+N+3).
Rigid board tolerances
- Copper to edge of PCB:
- Routing: Min. 0.008" for outer layer and 0.014" for inner layers (0.020" preferred for inner layers)
- V-cut: Min. 0.015" for outer layers and 0.020" for inner layers
- Pad size/Annular ring
- + 0.006" over finished via size
- + 0.012" over finished component hole size
- Annular ring (radius of the pad)
- + 0.003" for via
- + 0.006" (Min.) for component holes
- Hole size
- PTH +/-0.002", NPTH +/-0.001" based on 1 oz and 2 oz
- Min. finished hole size: 0.004"
- Rout/Punch (Board outline)
- +/- 0.004" for production
- Note: rout/Punch to board size using the center of the board outline on mask layer
- PCB finished thickness
- Overall may vary +/- 10% (Min. +/- .004")
- 2Layer: 0.005" - 0.236"
- 4Layer: 0.020" - 0.315"
- 6Layer: 0.031" - 0.315"
- 8Layer: 0.047" - 0.315"
- 10Layer: 0.062" - 0.315"
- Inner layer clearances: Min. 0.008"
- Inner layer thickness tolerance: +/-0.001"
- Trace width/spacing
- 0.5oz finished Min. trace width/space 0.003" (inner & outer)
- 1oz finished Min. trace width/space 0.004" (inner & outer)
- 2oz finished Min. trace width/space 0.008" (inner & outer)
- 3oz finished Min. trace width/space 0.010" (inner & outer)
- 4oz finished Min. trace width/space 0.012" (inner & outer)
- Solder mask swell (expansion of mask relief over pad area)
- Min. 0.005" over pad size or 0.0025" each side
- Slot width
- Min. 0.031" by routing in width, Min. 0.016" PTH by drilling
- Tolerance +/-0.003"
- Tab rout spacing
- Min. 0.040" spacing between individual boards for tab rout spacing
- Min. 0.015" for scoring
- Silkscreen (legend)
- Min. 0.005" line width
